We support our partners with all aspects of 3D application development. Our customers can choose between an existing standard PhotonIC® sensor or a custom-designed chip developed to meet their specific requirements. What’s more, we offer a range of additional services, from development of a sensor IC right through to the design of entire 3D camera environments.

Leveraging our extensive experience and expertise, we develop sensor modules based on printed circuit boards (PCB), including entire hardware and software architectures. Furthermore, our experts provide support for PCB design – using state-of-the-art high-speed analog and digital development environments. We also offer digital system design (VHDL) for maximum application flexibility and maximum customer satisfaction.

Leveraging our 3D image-processing skills, we can deliver tailored embedded software solutions for a variety of platforms – in line with your specific needs.

High-quality optical components are essential for imaging systems. That’s why we’ve developed comprehensive skills in this area. And our partners benefit from our specialized knowledge in a wide variety of ways. We offer a range of services – from cost-effective optics (e.g. at chip level), to complex, high-performance multi-lens systems.

There are a number of ways to solve illumination challenges in ToF applications. Whether you’re after advice on high-speed, high-power illumination or need support developing an application-specific illumination solution for mass production, our experts have an answer for you.